H

Highness Microelectronics Ltd.

SMEBSE
ListedListed on 2 Apr 2026+4.2%

₹114–120

₹ 16 Cr

2400 Shares

₹ 2,73,600

₹10

Financial Summary

Standalone(in ₹ million)
ParticularsFY 2025-26FY 2024-25
1,61,191.871,40,737.82
7,983.11,000.29
1,69,174.971,41,738.11
93,645.5594,484.53
53,457.3432,660.11
41,039.1924,582.08

Subscription Details

180.32xTotal
Subscription
185.10x
268.13x
81.95x
0.00x

IPO Timeline

IPO Offer Start

24 Mar 2026

IPO Offer Ends

27 Mar 2026

2 Apr 2026

Use of Proceeds

#PurposeAmount (₹ Million)
1Funding the capital expenditure requirements of our Company50
2Funding the Working Capital Requirement of our Company55
3Repayment and/or prepayment, in full or part, of borrowing availed by our 21

Promoters

Gaurav Manjul KejriwalManjul Kumar KejriwalShruti Gaurav Kejriwal

Book Running Lead Managers

Fintellectual Corporate Advisors Pvt Ltd.

Promoter Shareholding

Pre-IPO

99.90%

Promoter stake

Post-IPO

64.90%

Promoter stake

Offered to Public

12,94,800

shares

Post Share Capital

33,54,090

shares

About the Company

We are engaged in the business of providing products and solutions towards electronics system design and manufacturing (“ESDM”) services with a focus on high value precision engineering products. We offer tailored solutions to meet our customers’ specific needs, covering assembly and integration of precision components. Based on the client’s specifications, we design and manufacture the required products. We are specialized in design and supply of embedded systems, particularly in the defense, space, and industrial automation sectors. Our solutions mainly include: (i) printed circuit board design and assembly, (ii) end-to-end design services from concept and engineering to prototype development and manufacturing of products. These comprehensive services help our customers reduce manufacturing costs, streamline supply chain management, and minimize inventory obsolescence. It is important to note that while we manage the full process, fabrication is carried out by external partners. Our Company offers a diverse portfolio of products and services across multiple industry sectors. We have consistently evolved to align with emerging technologies, dynamic customer requirements, and ongoing industry advancements. Our product offerings include: (1) embedded products and systems, (2) display and sensor solutions, and (3) turnkey systems. In addition to these, we also provide mechanical designing services to our customers, offering complete support from concept to final product.

Use of Proceeds

1. Funding the capital expenditure towards setting up an assembly line at factory situated at R-364, TTC Industrial Area, Rabale, Mumbai-400701. 2. Funding the working capital requirement of our Company. 3. Repayment and/or pre-payment, in full or part, of borrowing availed by our Company. 4. General Corporate Purposes