India’s First 3D Chip Packaging Unit in Odisha
Key Highlights
Foundation laid for India’s first advanced 3D chip packaging unit in Odisha’s Info Valley, boosting high-tech manufacturing and the local economy.
A significant milestone for high-tech manufacturing in Odisha was marked with the laying of the foundation stone for India’s first advanced 3D chip packaging unit in the state’s Info Valley.
Union Minister for Electronics & IT Ashwini Vaishnaw announced the development, stating that the foundation stone for the semiconductor plant was laid on the auspicious occasion of Akshay Tritiya.
Vaishnaw expressed his gratitude to Prime Minister Narendra Modi and Odisha Chief Minister Mohan Charan Majhi, acknowledging their support in establishing the facility.
The upcoming plant is expected to significantly boost high-tech manufacturing capabilities within the state of Odisha.