Highness Microelectronics Ltd.
SMEPrice Range
₹114–120
Issue Size
₹ 16 Cr
Lot Size
2400 Shares
Min. Investment
₹ 2,73,600
Financial Summary
(in crores)| Particulars | FY 2024-25 | FY 2023-24 |
|---|---|---|
| Operating Revenue | 1,40,737.82 | 1,07,046.22 |
| Other Income | 1,000.29 | 2,887.46 |
| Total Income | 1,41,738.11 | 1,09,933.68 |
| Total Expenses | 94,484.53 | 47,244.8 |
| Profit Before Tax | 32,660.11 | 31,621.51 |
| Total Profit | 24,726.84 | 23,726.08 |
Subscription Details
Subscription
IPO Timeline
IPO Offer Start
24 Mar 2026
IPO Offer Ends
27 Mar 2026
Listing Date
2 Apr 2026
Use of Proceeds
| # | Purpose | Amount (₹ Cr) |
|---|---|---|
| 1 | Funding the capital expenditure requirements of our Company | 50 |
| 2 | Funding the Working Capital Requirement of our Company | 55 |
| 3 | Repayment and/or prepayment, in full or part, of borrowing availed by our | 21 |
Promoters
Promoter Shareholding
Pre-IPO
99.90%
Promoter stake
Post-IPO
64.90%
Promoter stake
Offered to Public
12,94,800
shares
Post Share Capital
33,54,090
shares
About the Company
We are engaged in the business of providing products and solutions towards electronics system design and manufacturing (“ESDM”) services with a focus on high value precision engineering products. We offer tailored solutions to meet our customers’ specific needs, covering assembly and integration of precision components. Based on the client’s specifications, we design and manufacture the required products. We are specialized in design and supply of embedded systems, particularly in the defense, space, and industrial automation sectors. Our solutions mainly include: (i) printed circuit board design and assembly, (ii) end-to-end design services from concept and engineering to prototype development and manufacturing of products. These comprehensive services help our customers reduce manufacturing costs, streamline supply chain management, and minimize inventory obsolescence. It is important to note that while we manage the full process, fabrication is carried out by external partners. Our Company offers a diverse portfolio of products and services across multiple industry sectors. We have consistently evolved to align with emerging technologies, dynamic customer requirements, and ongoing industry advancements. Our product offerings include: (1) embedded products and systems, (2) display and sensor solutions, and (3) turnkey systems. In addition to these, we also provide mechanical designing services to our customers, offering complete support from concept to final product.
Use of Proceeds
1. Funding the capital expenditure towards setting up an assembly line at factory situated at R-364, TTC Industrial Area, Rabale, Mumbai-400701. 2. Funding the working capital requirement of our Company. 3. Repayment and/or pre-payment, in full or part, of borrowing availed by our Company. 4. General Corporate Purposes